发明名称 Process for the preparation of direct tabletting formulations and aids
摘要 A thermal adhesion granulation process for preparing direct tabletting formulations or aids is disclosed. The process comprises the step of subjecting all or part of a mixture comprising: A) from about 5 to about 99% by weight of one or more diluent excipients and/or from 0 to about 99% by weight of a pharmaceutically active ingredient; B) from about 1 to about 95% by weight of a binder excipient; optionally with, C) from 0 to about 10% by weight of a disintegrant excipient; to heating at a temperature in the range of from about 30 to about 130° C under the condition of low moisture or low content of a pharmaceutically-acceptable organic solvent in a closed system under mixing by tumble rotation until the formation of granules.
申请公布号 US2003017198(A1) 申请公布日期 2003.01.23
申请号 US20010847017 申请日期 2001.05.01
申请人 YEH TA-SHUONG;YEH DANIEL HUNGTING 发明人 YEH TA-SHUONG;YEH DANIEL HUNGTING
分类号 A61K9/16;A61K9/20;(IPC1-7):A61K9/20;B27N3/00 主分类号 A61K9/16
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