发明名称 |
Integrated heat transfer device for PLC module |
摘要 |
There is provided a PLC module formed by depositing the core as an optical signal transmission medium and the clad surrounding the core on a semiconductor substrate, wherein a heating line is attached to the lower surface of the PLC and generates heat to the PLC from externally received power. An insulation layer is coated on the lower surface of the PLC with the heating line fixed thereto. Therefore, the direct attachment of the heating line to the lower surface of the PLC minimizes heat loss.
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申请公布号 |
US2003016900(A1) |
申请公布日期 |
2003.01.23 |
申请号 |
US20010974630 |
申请日期 |
2001.10.10 |
申请人 |
SHIN SANG-GIL;LEE SEUNG-WAN;KWON OH-DAL;JUNG SUN-TAE |
发明人 |
SHIN SANG-GIL;LEE SEUNG-WAN;KWON OH-DAL;JUNG SUN-TAE |
分类号 |
G02B6/122;G02B6/02;G02B6/12;G02B6/34;(IPC1-7):G02B6/12 |
主分类号 |
G02B6/122 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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