MULTILAYER WIRING BOARD ASSEMBLY, MULTILAYER WIRING BOARD ASSEMBLY COMPONENT AND METHOD OF MANUFACTURE THEREOF

摘要

PURPOSE: A multilayer wiring board assembly, a multilayer wiring board assembly component and a method of manufacture thereof are provided to easily laminate together flexible FPCs having highly packing densities by via-on-via and chip-on-via. CONSTITUTION: A multilayer wiring board assembly component(20) comprises a copper plated resin film(10) made of a resin film(1) having adhesivity which is provided with a copper foil(2) bonded to one surface thereof and in which a through hole(7) is opened through the copper foil and the resin film, and a conductive paste filler(8) embedded by screen printing in the through hole of the copper plated resin film from the copper foil with a leading end of the conductive paste filler being projected from the resin film.