| 摘要 |
The invention relates to a method for producing a polymer-free area, characterized by applying at least one peelable layer to the substrate, and/or to one or more polymer layer(s) disposed on the substrate, in those areas where a polymer-free area is formed on the substrate by removing the peelable layer. The invention thus provides a method for producing polymer-free bonding areas or, by disposing a diode protecting cap on the polymer-free area of the substrate, a hermetically sealed link between the substrate and the diode protecting cap. |
