HEAT SINK FRAME FOR DETECTING WIRE BONDING STATE AND METHOD FOR DETECTING WIRE BONDING STATE USING THE SAME

摘要

PURPOSE: A heat sink frame for detecting a wire bonding state is provided to apply a wire bonding monitoring system to a wire bonding process of a printed circuit board having an attached heat sink by installing a conductive pad for inspection in which a ground signal is connected to a rail part of the heat sink frame in the wire bonding process. CONSTITUTION: The heat sink(210) is composed of a unit of an almost rectangular type. A metal pad(230) for ground is formed on the heat sink. The rail part(220) fixedly supports a plurality of heat sinks, formed in a straight line at both sides of the heat sink. The conductive pad(222) for inspection is formed in the rail part.