发明名称 Improvements in or relating to semiconductor diode assemblies
摘要 992,507. Semi-conductor diode assembly. PHILIPS ELECTRONIC & ASSOCIATED INDUSTRIES Ltd. July 4, 1962 [July 7, 1961], No. 25660/62. Heading H1K. A semi-conductor diode assembly consists of a preferably insulating tubular holder containing one or more disc-shaped or tubular semi-conductor diodes and having a plurality of slots through each of which a tag portion of a cooling plate projects into the interior of the holder to thermally contact a diode. Each cooling has an outer part 7 (Fig. 3) partially embracing the holder. The tag may be tapered (Fig. 7, not shown) so as to engage a holder with longer slots in one wall than in the other. The embodiment of Fig. 8 has a ceramic envelope 1 and two metal end caps 2 enclosing a diode, held between resilient tags 12 of cooling plates 11, which plates serve also as current electrodes to the diode. In a further arrangement (Fig. 9, not shown) several diodes separated by conductive discs and positioned by an intermediate spring in a ceramic tube are interconnected in a circuit arrangement with the tags carrying the currents. The tag ends protruding from the tubular bodies are twisted or bent over to position the holder relative to the supporting plates.
申请公布号 GB992507(A) 申请公布日期 1965.05.19
申请号 GB19620025660 申请日期 1962.07.04
申请人 PHILIPS ELECTRONIC AND ASSOCIATED INDUSTRIES LIMITED 发明人
分类号 C07F7/22;C08F10/00;H01L23/367;H01L23/40;H01L25/10;H01L25/11 主分类号 C07F7/22
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