Integrated testing of wafers with semiconducting elements involves conducting electrical testing on test structure and simultaneously on at least one functional semiconducting component

摘要

The test method involves conducting electrical testing on a test structure, especially in a scratch frame, and simultaneously conducting electrical testing on at least one functional semiconducting component. The electrical testing is carried out on all functional semiconducting components on a wafer. The first step (1) involves at least one test with direct current and/or a frequency less than or equal to 100 Hz. AN Independent claim is also included for the following: an arrangement for implementing the method.