A resin composition which comprises a polyimide comprising a specific acid dianhydride and a specific diamine, and an epoxy resin. The resin composition is capable of exhibiting adhesiveness at a relatively low temperature, is excellent in heat resistance, adhesive characteristics and the resistance to soldering heat, and exhibits high retention of peel strength after the PCT treatment. The formation of a circuit by using a polyimide resin sheet comprising the above resin composition or the polyimide resin sheet having a metal foil attached thereto and according to the semi−additive method can provide a printed wiring board having a good interconnecting pattern, a firmly adhered circuit, and a space portion in a fine circuit exhibiting a high insulation resistance.
