发明名称 |
Method of manufacturing a semiconductor memory device with a gate dielectric stack |
摘要 |
A method of manufacturing a semiconductor memory device with a gate dielectric stack is provided. A first insulating layer is formed on a semiconductor substrate with a first conductive type. A first conductive layer is formed on the first insulating layer. A second insulating layer with a stack of silicon dioxide/silicon nitride/silicon oxynitride/silicon dioxide is formed on the first conductive layer. A second conductive layer is formed on the second insulating layer. Patterning the first insulating layer, the first conductive layer, the second insulating layer and the second conductive layer to form a first gate dielectric layer, a floating gate, a second gate dielectric layer and a control gate. A source/drain with a second conductive type beside the floating gate is formed in the semiconductor substrate.
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申请公布号 |
US2003017670(A1) |
申请公布日期 |
2003.01.23 |
申请号 |
US20010908704 |
申请日期 |
2001.07.20 |
申请人 |
MACRONIX INTERNATIONAL CO., LTD. |
发明人 |
LUOH TUUNG;LIN CHIN-HSIANG;HWANG YAW-LIN |
分类号 |
H01L21/28;H01L21/314;H01L29/51;(IPC1-7):H01L21/336;H01L21/31;H01L21/469 |
主分类号 |
H01L21/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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