发明名称 Method of manufacturing a semiconductor memory device with a gate dielectric stack
摘要 A method of manufacturing a semiconductor memory device with a gate dielectric stack is provided. A first insulating layer is formed on a semiconductor substrate with a first conductive type. A first conductive layer is formed on the first insulating layer. A second insulating layer with a stack of silicon dioxide/silicon nitride/silicon oxynitride/silicon dioxide is formed on the first conductive layer. A second conductive layer is formed on the second insulating layer. Patterning the first insulating layer, the first conductive layer, the second insulating layer and the second conductive layer to form a first gate dielectric layer, a floating gate, a second gate dielectric layer and a control gate. A source/drain with a second conductive type beside the floating gate is formed in the semiconductor substrate.
申请公布号 US2003017670(A1) 申请公布日期 2003.01.23
申请号 US20010908704 申请日期 2001.07.20
申请人 MACRONIX INTERNATIONAL CO., LTD. 发明人 LUOH TUUNG;LIN CHIN-HSIANG;HWANG YAW-LIN
分类号 H01L21/28;H01L21/314;H01L29/51;(IPC1-7):H01L21/336;H01L21/31;H01L21/469 主分类号 H01L21/28
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