ULTRA-THIN SEMICONDUCTOR PACKAGE DEVICE USING SUPPORT TAPE

摘要

PURPOSE: An ultra-thin semiconductor package device using a support tape is provided to form a semiconductor package device having thin thickness by using a plastic package technique. CONSTITUTION: A semiconductor chip(30) has a plurality of electrode pads(32) formed on an active face(34) and a bottom face(36) as an opposite face to the active face(34). A lead frame has an inner lead(42) connected with an electrode pad of the semiconductor chip(30) and an outer lead(44). A heatproof support tape(50) is adhered on an upper surface of the inner lead(42) and the active face(34) of the semiconductor chip(30) in order to support the inner lead(42) and the semiconductor chip(30). A plurality of bonding wires(60) are used for connecting electrically the electrode pads(32) of the semiconductor chip(30) with the inner lead(42). A molding body(70) is used for protecting the semiconductor chip(30), the support tape(50), and the bonding wires(60).