| 摘要 |
PURPOSE: A method of an exposure process for fabricating a semiconductor wafer is provided to reduce reworking processes and increase productivity by performing a recovery alignment mode when an alignment process for wafers is failed. CONSTITUTION: A wafer is loaded(50). An alignment process is performed by initial mark coordinates(60). A recovery alignment mode is performed and the alignment process is performed by the first recovery alignment mark coordinates if the alignment process is failed by a mark error(70,100,110). The alignment processes are repeatedly performed by the second and the third recovery alignment mark coordinates if the alignment process is failed(120). An exposure process is performed if the alignment process is performed successfully(120,130). An interlock is generated by an interlock program after the exposure process is finished(140). A pattern test for the wafer is performed(150). A rework process is performed and the wafer is transferred to a process prior to the exposure process if the wafer is failed in the pattern test(160,170). The alignment process, the exposure process, and the pattern test are normally performed if the current mode of the wafer is not changed to the recovery mode(80,90).
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