发明名称 METHOD FOR FABRICATING ARRAYED CHIP COMPONENTS
摘要 PURPOSE: A method for fabricating array type chip components is provided to enhance reliability of the array type chip components by forming an upper and a lower terminal electrode prior to form an external electrode. CONSTITUTION: A plurality of ceramic sheets are prepared. An internal electrode of a predetermined pattern is formed on an upper portion of one ceramic sheet. A plurality of terminal electrodes(33a) are formed by printing conductive paste in a predetermined interval on an upper surface of the other ceramic sheet. The terminal electrodes(33a) are extended from both sides of the ceramic sheet to the inside of the ceramic sheet. The terminal electrodes(33a) faces to each other. A stacked body(32) is formed by stacking the ceramic sheet including the terminal electrodes(33a) on an upper portion and a lower portion of the ceramic sheet including the internal electrode. A sintering process for the stacked body(32) is performed. An external electrode(33) is formed by coating conductive paste on a side of the stacked body(32).
申请公布号 KR20030005743(A) 申请公布日期 2003.01.23
申请号 KR20010041177 申请日期 2001.07.10
申请人 SAMSUNG ELECTRO-MECHANICS CO., LTD. 发明人 BAE, HONG YEOL;KIM, DAE JIN;LEE, JONG HYEOK;PARK, JONG WON
分类号 H01F41/00;(IPC1-7):H01F41/00 主分类号 H01F41/00
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