| 摘要 |
A method and apparatus for dispensing adhesive on a support substrate for carrying microelectronic substrates. In one embodiment, the apparatus can include at least one dispense nozzle having at least one aperture configured to dispense the adhesive along a dispense axis toward the support substrate. The dispense nozzle can be coupleable to a source of the adhesive, and the apparatus can further include a standoff member operatively coupled to the at least one dispense nozzle. The standoff member can include a contact surface that projects beyond the aperture and is configured to contact the support substrate while the aperture of the dispense nozzle is spaced apart from the support substrate. Accordingly, the nozzle can consistently be spaced apart from the support substrate while the adhesive is dispensed onto the support substrate.
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