| 摘要 |
For use in the fabrication of semiconductor devices by electron beam lithography, a transport system provides relative displacement between an array of plural vacuum stations and a first ultra clean room for sequentially transporting each vacuum station through the first clean room. The first ultra clean room and vacuum stations are disposed in a second clean room having an atmosphere not as contaminant-free as the first ultra clean room. Each vacuum station includes an evacuated housing within which is disposed a combination of a semiconductor substrate, or wafer, and plural electron beam sources for forming integrated circuits on the substrate as the vacuum station is transported through the second clean room. The first ultra clean room is displaced along an aligned array of vacuum stations or the aligned array of vacuum stations are displaced through a stationary first ultra clean room to permit the electron beam formed integrated circuits to be removed from a vacuum station and be replaced by a new set of substrates.
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