SEMICONDUCTOR DEVICE AND PEELING OFF METHOD AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

摘要

PURPOSE: A semiconductor device and peeling off method and a method of manufacturing the semiconductor device are provided to peel off not only a peeled off layer having a small area but also a peeled off layer having a large area over the entire surface at excellent yield ratio. CONSTITUTION: The metal layer or nitride layer(11) is formed on the substrate. The oxide layer(12) that is contact with the foregoing metal layer or nitride layer is provided, and if the lamination film formation or the heat processing of 500 C. or more in temperature is performed, it can be easily and clearly separated in the layer or on the interface with the oxide layer by the physical means.