摘要 |
Provided is a clamping unit for die clamping with a die-clamping force directly applied to dies consisting of a stationary die and a movable die, including a stationary platen for holding the stationary die, a movable platen for holding the movable die, the movable platen being disposed opposite to the stationary platen, and a linear guiding system for guiding the movement of the movable platen.
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