| 摘要 |
PURPOSE: A heat-sink apparatus of a semiconductor package is provided to cool effectively the heat generated from a plurality of semiconductor packages arrayed on a PCB(Printed Circuit Board) and prevent a malfunction due to EMI/EMC by using a heat-sink pin or a heat-sink spring. CONSTITUTION: A PCB(1) including a plurality of semiconductor packages(3) is surrounded by a heat-sink portion(17) having a heat-sink cover portion(17a) and a heat-sink plate portion(17b). A heat-sink pin groove portion(11) is formed at the heat-sink cover portion(17a). A heat-sink pad portion(15) is formed to an edge of the heat-sink cover portion(17a). The heat-sink pin groove portion(11) is coupled with a heat-sink pin portion(13) having a plurality of grooves. The heat-sink pin portion(13) is contacted with the semiconductor packages(3) of the PCB(1).
|
