发明名称 |
Heat sink, cooling member, semiconductor-substrate cooling system, computer, and radiation method |
摘要 |
A heat sink, cooling member, semi-conductor substrate cooling system, computer and method for providing sufficient cooling performance through a heat sink is provided. In part, there is provided a heat sink having a radiating portion for diffusing the heat conducted from a heat source and a blasting fan for blasting air to a duct-like structure formed by the radiating portion. Moreover, rates of airflows in the duct-like structure are averaged so that air circulates through all portions in the duct-like structure by forming a high-wind-pressure portion and a low-wind-pressure portion having wind pressures different from each other when air is blasted by the blasting fan in the duct-like structure and using the high-wind-pressure portion as a high-density area having a high arrangement density of radiating fins compared to the low-wind-pressure portion.
|
申请公布号 |
US2003016497(A1) |
申请公布日期 |
2003.01.23 |
申请号 |
US20020153959 |
申请日期 |
2002.05.23 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MATSUI YOHICHI;NOMURA TAICHIROH;KAMIMURA TAKUROH |
分类号 |
H05K7/20;G06F1/20;H01L23/467;(IPC1-7):H05K7/20 |
主分类号 |
H05K7/20 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|