发明名称 Optical semiconductor component package and optical pickup device
摘要 In an optical semiconductor package according to the present invention, the component bearing surface of the stem having an outline made up of opposed first and second circular-arc parts, a first straight-line part which connects each end of the first and second circular-arc parts and a second straight-line part which connects each other end of the first and second circular-arc parts. The first and second circular-arc parts have a common center, and the first circular-arc part has a larger radius than that of the second circular-arc part. Thus, the larger space, the space between the first circular-arc part and the center, can be used for disposing the light detector or a polarization split element, and the unused space, the space between the second circular-arc part and the center, will be minimum, thereby realizing downsizing and cost reduction of the device.
申请公布号 US2003015717(A1) 申请公布日期 2003.01.23
申请号 US20020187712 申请日期 2002.07.01
申请人 SHARP KABUSHIKI KAISHA 发明人 OGAWA MASARU
分类号 G11B7/125;H01L23/04;H01L31/02;H01L31/16;H01S5/022;(IPC1-7):H01L31/12 主分类号 G11B7/125
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