发明名称 Semiconductor device
摘要 The transistors share the sameness in the areas of gate oxide films 2a and 2b, and in those of the side surfaces of sixth metal wiring layers 15a and 15b to be exposed in a metallization patterning process by a plasma process such as plasma etching and the like in order to form the uppermost layer. For this reason, the transistors share the sameness in antenna ratio. The pairing transistors are suffered from the damage of the same level induced by plasma transmitted from the side surfaces of sixth metal wiring layers 15a and 15b to gate oxide films 2a and 2b.
申请公布号 US2003015797(A1) 申请公布日期 2003.01.23
申请号 US20020175445 申请日期 2002.06.20
申请人 NOGAWA TAKESHI 发明人 NOGAWA TAKESHI
分类号 H01L23/522;H01L21/768;H01L21/822;H01L21/8234;H01L23/485;H01L27/04;H01L27/088;(IPC1-7):H01L23/48;H01L23/52;H01L29/40 主分类号 H01L23/522
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