发明名称 |
FEED−THROUGH MANUFACTURING METHOD AND FEED−THROUGH |
摘要 |
A method for manufacturing a feed−through comprising a substrate having a plurality of through conductive parts formed therein, characterized by comprising a stopper film forming step for forming stopper film on one face of the substrate, a hole part forming step for forming a plurality of hole parts reaching the stopper film by etching the substrate, a conductive part forming step for forming the plurality of conductive parts in the plurality of holes, a stopper film removal step for removing the stopper film by etching, and a conductive part projecting step for projecting the tips of the plurality of conductive parts from the substrate by etching the surface of the substrate from which the stopper film was removed.
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申请公布号 |
WO03007430(A1) |
申请公布日期 |
2003.01.23 |
申请号 |
WO2002JP06435 |
申请日期 |
2002.06.26 |
申请人 |
TOKYO ELECTRON LIMITED;YUASA, MITSUHIRO |
发明人 |
YUASA, MITSUHIRO |
分类号 |
G01R1/073;G01R3/00;H01L21/48;H01R11/01;H01R43/00;H05K3/40;(IPC1-7):H01R11/01;G01R1/06;H01L21/66 |
主分类号 |
G01R1/073 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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