发明名称 |
APPARATUS FOR PREVENTING SLIDING OF WAFER |
摘要 |
PURPOSE: An apparatus for preventing sliding of a wafer is provided to prevent a damage or a loss of a wafer by transferring process of the wafer. CONSTITUTION: A chuck(10) has a round groove(20) having the same size as a diameter of a wafer. The round groove(20) is formed at a predetermined position apart from an edge of the chuck(10). The chuck(10) includes a plurality of tips(12) for fixing the wafer. A plurality of fingers are formed between an end portion of the chuck(10) and the tips(12). The fingers are used for lifting the wafer loaded on the round groove(20). The fingers can be shifted to an upper portion or a lower portion.
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申请公布号 |
KR20030006222(A) |
申请公布日期 |
2003.01.23 |
申请号 |
KR20010041919 |
申请日期 |
2001.07.12 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
LEE, SEONG BIN |
分类号 |
H01L21/205;(IPC1-7):H01L21/205 |
主分类号 |
H01L21/205 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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