| 摘要 |
<p>A method for packaging wafers having a bottom side and a top circuit side in jars comprising the steps of placing a cassette (c) having a plurality of pockets for wafers at the back side facing upward, transferring the top wafer (w) in the cassette by means of a vacuum suction mechanism which centers the top wafer in the cassette pocket upon initial engagement and then transfers and discharges the wafer in a jar (j) located at a jar station and feeding interleaf in timed relation to the wafer feed so that an interleaf is positioned between each wafer loaded in a jar.</p> |
