WAFER-REPAIR EQUIPMENT INCLUDING TEST GRID

摘要

PURPOSE: Wafer-repair equipment including a test grid is provided to easily perform a process and to shorten an interval of delay time caused by a manual operation by installing a tool for horizontally aligning the test grid on the surface of a chuck. CONSTITUTION: Horizontal and vertical lattice lines are formed in the test grid(120). The test grid is placed on the chuck(110). The wafer-repair equipment includes the test grid, the chuck and laser. The tool(210) for horizontally aligning the test grid on the upper surface of the chuck is installed in the chuck. The tool can be installed/uninstalled in/from the chuck.