| 摘要 |
<p>995,714. Severing crystals. INTERNATIONAL BUSINESS MACHINES CORPORATION. Oct. 16, 1963 [Oct. 30, 1962], No. 40768/63. Heading B5E. [Also in Divisions H1 and H3] A method of severing a crystalline body 1, such as for use in a laser, comprises the steps of positioning the body to define a plane of minimum bond strength and applying localized stress to the body to separate it into at least two portions along the plane. The body 1 is in the form of a wafer which is separated from a larger crystalline body and provided with surfaces 1, 2 located in planes perpendicular to the plane of minimum bond strength, the said planes being determined by means of X-ray equipment; the surfaces 1, 2 may be finished such as by a lapping or polishing process. The wafer is then laid on a supporting member and a blade 4 forced against its surface 3 in order to cleave it along the plane of minimum bond strength. The blade 4 may be re-positioned so as to cut a rectangular or triangular shaped crystal from the wafer.</p> |
