| 摘要 |
<p>PCT No. PCT/DE98/01552 Sec. 371 Date Dec. 9, 1999 Sec. 102(e) Date Dec. 9, 1999 PCT Filed Jun. 8, 1998 PCT Pub. No. WO98/57774 PCT Pub. Date Dec. 23, 1998Method for repairing defective soldered joints, in which in a first method step a soldering material handling device is placed with a soldering material removal device at a soldering material defect point and a defective soldering material deposit is loosened from the connection with a soldering material carrier and removed, and in which in a second method step a soldering material unit from a soldering material application device of the soldering material handling device is applied to the soldering material carrier and connected to the soldering material carrier, the application device being placed at the soldering material defect point.</p> |
