发明名称 Laser beam machining apparatus and laser beam machining method
摘要 <p>A laser beam machining apparatus forms blind holes at predetermined intervals in a workpiece by intermittently irradiating a laser beam from a laser nozzle to the workpiece while the laser nozzle and the workpiece being moved relatively. During the time the workpiece is subjected to machining, the electrostatic capacity between the support member 11 and the laser nozzle is detected by an electrostatic capacity sensor 19 while the workpiece made of conductive material is supported on the support member. The irradiation output power is controlled by a control unit which operates to vary the number of output pulses from the laser nozzle each time one hole is formed according to the result detected in response to variation in the thickness of the workpiece.</p>
申请公布号 GB2377664(A) 申请公布日期 2003.01.22
申请号 GB20020014419 申请日期 2002.06.21
申请人 * NIPPEI TOYAMA CORPORATION 发明人 SHUSO * KANAYA;YUICHI * MORITA
分类号 B23K26/04;B23K26/38;B60R21/2165;(IPC1-7):B23K26/02 主分类号 B23K26/04
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