| 发明名称 |
Apparatus and method for bond force control |
| 摘要 |
<p>This invention relates to an apparatus and method for providing bond force control in a die bonding operation. It comprises means (11) for generating a primary bond force, means for generating a compensatory bond force (21) in the same direction or opposite to said primary bond force, and means for controlling the compensatory bond force whereby a bond force comprising the sum of the primary bond force and the compensatory bond force may be controlled. <IMAGE></p> |
| 申请公布号 |
EP1278232(A2) |
申请公布日期 |
2003.01.22 |
| 申请号 |
EP20020254979 |
申请日期 |
2002.07.16 |
| 申请人 |
ASM ASSEMBLY AUTOMATION LTD. |
发明人 |
WONG, SUN KUEN;WAN, MING YEUNG |
| 分类号 |
B23K20/02;H01L21/00;(IPC1-7):H01L21/00 |
主分类号 |
B23K20/02 |
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