发明名称 Dual wafer load lock
摘要 <p>The disclosure relates to method and apparatus for transferring a substrate between a first environment having a first pressure and a second environment having a vacuum pressure is provided. In one embodiment, the apparatus comprises a chamber body (202) having a first port (238) disposed in a first wall (208) and a second port (239) disposed in a second wall that seals the chamber from the first and second environments. A cooling plate (280), a first substrate holder (204) and a second substrate holder (206) are disposed within the chamber body. The cooling plate is disposed at the bottom (216) of the chamber body. The first port and the second port are sequentially opened and the pressure within the load lock regulated to allow substrate to pass through the load lock. A window (250) is disposed in the top of the chamber body that allows a metrology device (428) to view the chamber volume. <IMAGE> <IMAGE> <IMAGE></p>
申请公布号 EP1278230(A2) 申请公布日期 2003.01.22
申请号 EP20020254961 申请日期 2002.07.15
申请人 APPLIED MATERIALS, INC. 发明人 KRAUS, JOSEPH ARTHUR;STRASSNER, JAMES DAVID
分类号 C23C14/50;B65G49/07;H01L21/00;H01L21/205;H01L21/302;H01L21/3065;H01L21/677;(IPC1-7):H01L21/00 主分类号 C23C14/50
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