CIRCUIT BOARD PRODUCING METHOD AND CIRCUIT BOARD PRODUCING DEVICE

摘要

A method of manufacturing multi-layer circuit board comprising: a hole forming step for forming through-holes or blind-holes in a plate-form or sheet-form board material, and a filling step for filling a paste into through- holes or blind-holes formed in the hole forming step by using a filling means. A second paste is supplied to the paste in the filling process by using a paste supplying means to stabilized a viscosity of the paste and the paste is reliably filled into the through- holes or the blind-holes.