| 发明名称 |
ELECTROPLATING BATH COMPOSITION AND METHOD OF USING |
| 摘要 |
The present invention relates to a copper electroplating bath composition and method of using it for microelectronic device fabrication. In particular, the present invention relates to copper electroplating in the fabrication of interconnect structures in semiconductor devices. By use of the inventive copper electroplating bath composition, the incidence of voids in the interconnect structures is reduced. |
| 申请公布号 |
EP1276919(A2) |
申请公布日期 |
2003.01.22 |
| 申请号 |
EP20010927065 |
申请日期 |
2001.04.10 |
| 申请人 |
INTEL CORPORATION |
发明人 |
HONG, KIMIN;BAXTER, NATHAN, E.;DUBIN, VALERY, M. |
| 分类号 |
C25D3/38;C25D5/18;C25D7/12;(IPC1-7):C25D3/38 |
主分类号 |
C25D3/38 |
| 代理机构 |
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