Structure and fabrication process for an improved polymer light emitting diode

摘要

The present invention discloses an organic light-emitting diode (LED). The organic light emitting diode is supported on an indium/tin oxide 110 (ITO) coated glass substrate 105. The organic light-emitting diode includes an amorphous-silicon (alpha-Si) resistive layer 115 covering the ITO 110 coated glass substrate 105. The organic light-emitting diode 100 further includes a polyaniline (PANI) layer 120 covering the amorphous silicon (alpha-Si) resistive layer 115 and an organic light emitting layer 125 overlying the PANI layer 120. And, the organic light-emitting diode 100 further has a conductive electrode layer 130 covering the light emitting layer 125. In a preferred embodiment, the amorphous silicon (alpha-Si) resistive layer 115 functioning as a current limiting layer for limiting a current density conducted between the ITO 110 coated glass substrate 105 and the conductive electrode layer 130 under a maximum allowable current density of 1000 mA/cm2. In another preferred embodiment, the amorphous silicon (alpha-Si) resistive layer 115 functioning as a current distribution layer for distributing a current conducted between the ITO coated glass substrate and the conductive electrode layer. Thus, the difference between a greatest current density from a smallest current density is under a maximum allowable current density difference of 1000 mA/cm2. In summary, this invention discloses an organic light-emitting diode (LED) 100 that includes an inorganic layer 115 functioning as a current limiting layer.