发明名称 Local loop telecommunication repeater housings employing thermal collection, transfer and distribution of waste heat via solid thermal conduction, and providing removable access to voltage protector assemblies without removing repeater modules
摘要 An improved service access and heat transfer design for passively cooled telecommunication repeater housings for use with wire transmission in the local loop outside plant is achieved by a cover, sealable to the housing's sidewall, removable to provide field replaceable, plug-in access to the repeater modules and voltage protector assemblies wherein the voltage protector assemblies can be installed and removed without first removing the repeater modules protected by those voltage protector assemblies and by replacing the known convection based heat transfer designs with a design based on solid thermal conduction. Thermal sleeves, which mount the repeater modules, collect the repeater modules' waste heat through thermal interfaces, transfer the waste heat along thermal conduction paths to the housing's sidewalls, and then distribute the waste heat over a substantial portion of the housing's sidewalls.
申请公布号 US6510223(B2) 申请公布日期 2003.01.21
申请号 US20010952547 申请日期 2001.09.14
申请人 ANACAPA TECHNOLOGY, INC. 发明人 LAETSCH ERICH K.
分类号 H05K7/20;(IPC1-7):H05K7/20 主分类号 H05K7/20
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