发明名称 LAMINATED POLYESTER FILM
摘要 PROBLEM TO BE SOLVED: To provide a low cost mold release film which is suitable for, for example, molding an insulating layer of a printed circuit board, a ceramic product manufacturing field (ceramic laminated capacitor or the like) or a pressure sensitive adhesive protecting having an easy control of a release force in a heavy release force region, having good slipperiness even on a flat film surface and having no possibility of adhesive property fault in a boundary between a silicone mold release layer and a polyester film. SOLUTION: The laminated polyester film having at least uniaxially stretched two or more layers comprises at least one outermost layer (A) made of a polyester containing a silicone component and containing Si in its surface of 1.00 g/m<2> or less.
申请公布号 JP2003019779(A) 申请公布日期 2003.01.21
申请号 JP20010208994 申请日期 2001.07.10
申请人 MITSUBISHI POLYESTER FILM COPP 发明人 KUNUGIHARA KAZUHIRO
分类号 B32B27/36;C08L67/00;C08L83/04;(IPC1-7):B32B27/36 主分类号 B32B27/36
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