发明名称 Multi-layer conductive device interconnection
摘要 A conductive network includes a first conductive device having multiple first signal layers. Each first signal layer has a first substrate and a plurality of first conductive traces disposed on one side of the first substrate. The network further includes a second conductive device having multiple second signal layers. Each second signal layer has a second substrate and a plurality of second conductive traces disposed on one side of the second substrate. In addition, the network includes at least one bridge layer for electrically joining together the first and second conductive devices. The at least one bridge layer has a bridge substrate and a plurality of bridge traces supported by the bridge substrate.
申请公布号 US6508674(B1) 申请公布日期 2003.01.21
申请号 US20000690348 申请日期 2000.10.18
申请人 STORAGE TECHNOLOGY CORPORATION 发明人 SVENKESON JOHN W.;HAMRE JOHN D.
分类号 H01R12/10;H01R12/24;H01R12/26;H05K3/36;(IPC1-7):H01R29/00 主分类号 H01R12/10
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