LEAD FRAME LOADING PANEL OF SEMICONDUCTOR PACKAGE FOR IMPROVING MOLDING CHARACTERISTIC OF PACKAGE

摘要

PURPOSE: A lead frame loading panel of a semiconductor package for improving the molding characteristic of the package is provided to be capable of preventing epoxy from leaking to the outside of the loading panel and a semiconductor chip by forming the loading panel smaller than the semiconductor chip. CONSTITUTION: A semiconductor package is formed by attaching a semiconductor chip onto a loading panel(11) of a lead frame(10) using the epoxy coated on the loading panel. The loading panel of the lead frame is provided with a plurality of adhesive parts(11A) and a connecting part(11B) connected with the corner portions of the adhesive parts. At this time, the size of the loading panel is smaller than that of the semiconductor chip. Preferably, the leakage of the epoxy is prevented by minimally coating the epoxy on the adhesive part of the loading panel.