| 发明名称 |
Control of breakdown products in electroplating baths |
| 摘要 |
Disclosed are methods for analyzing additive breakdown products in electroplating baths as well as methods of controlling the presence of such breakdown products in electroplating baths.
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| 申请公布号 |
US6508924(B1) |
申请公布日期 |
2003.01.21 |
| 申请号 |
US20000584124 |
申请日期 |
2000.05.31 |
| 申请人 |
SHIPLEY COMPANY L.L.C. |
发明人 |
GOMEZ LUIS A.;BEICA ROZALIA;MORRISSEY DENIS;STEP EUGENE N. |
| 分类号 |
C25D7/12;C25D21/12;H01L21/288;(IPC1-7):C25D21/18 |
主分类号 |
C25D7/12 |
| 代理机构 |
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