发明名称 Electronic device with interleaved portions for use in integrated circuits
摘要 A capacitor for use in integrated circuits comprises a layer of conductive material. The layer of conductive material including at least a first portion and a second portion, wherein the first portion and the second portion are arranged in a predetermined pattern relative to one another to provide a maximum amount of capacitance per semiconductor die area.
申请公布号 US6509245(B2) 申请公布日期 2003.01.21
申请号 US20010940328 申请日期 2001.08.27
申请人 MICRON TECHNOLOGY, INC. 发明人 BAKER R. JACOB;BEIGEL KURT D.
分类号 G11C7/02;H01L21/02;H01L23/522;H01L27/02;H01L27/08;(IPC1-7):H01L21/20 主分类号 G11C7/02
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