发明名称 |
Method and apparatus for precoining BGA type packages prior to electrical characterization |
摘要 |
A method and apparatus for precoining a ball grid array (BGA) type package prior to electrical characterization of the package employs a heated pressing plate with a smooth, flat bottom. The heated pressing plate is controllably pressed against a plurality of solder balls attached to a chip scale package. The heated pressing planarizes the tops of the solder balls, thereby evening out height differences among the solder balls. With the height differences evened out, a grounding plate of a test fixture can be applied on the array of solder balls and reliably contact each of the solder balls that are to be grounded, regardless of their initial height differences.
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申请公布号 |
US6508845(B1) |
申请公布日期 |
2003.01.21 |
申请号 |
US20020151941 |
申请日期 |
2002.05.22 |
申请人 |
ADVANCED MICRO DEVICES, INC. |
发明人 |
TOSAYA ERIC S. |
分类号 |
G01R1/04;G01R31/28;H01L21/48;H05K3/34;(IPC1-7):H01L21/00;H01L21/64;H01L23/48;H01L23/52;H01L23/28 |
主分类号 |
G01R1/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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