发明名称 DISCHARGE PLASMA TREATING APPARATUS AND TREATING METHOD USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a discharge plasmas treating apparatus having an electrode by which high density plasma is generated in a remote type plasma treating apparatus capable of dealing with high speed large surface area treatment and free from giving damage to a base material. SOLUTION: In the plasma treating apparatus in which the discharge plasma obtained by mounting a solid dielectric at least on one counter surface of the counter electrodes, introducing a treating gas in-between the electrodes and applying pulse like electric field under a nearly atmospheric pressure is guided to a material to be treated which is arranged outside the discharge space and brought into contact with the material. The counter surface of the electrode has projecting and recessed portions in such manner that rectangular parallelepipeds are arranged vertically to the flowing direction of a treating gas, and the surfaces of the electrodes which face each other are arranged so as to face the projecting surfaces each other and the recessed surfaces each other.
申请公布号 JP2003019433(A) 申请公布日期 2003.01.21
申请号 JP20010206531 申请日期 2001.07.06
申请人 SEKISUI CHEM CO LTD 发明人 UEHARA TAKESHI
分类号 H05H1/46;B01J19/08;C03C15/00;C23C16/50 主分类号 H05H1/46
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