发明名称 REFLOW SOLDERING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a soldering method of a VPS(vapor phase soldering) system with the aim of mass production using tin - zinc based lead free solder thereby to realize electronic equipment having a long service life. SOLUTION: An inert liquid 2 having a known boiling point temperature higher than the melting point of solder by about 10 deg.C is evaporated, and the concentration of oxygen in the vapor atmosphere 2a is controlled to <=300 ppm, and reflow soldering is performed.
申请公布号 JP2003019590(A) 申请公布日期 2003.01.21
申请号 JP20010204414 申请日期 2001.07.05
申请人 NIHON DENNETSU KEIKI CO LTD 发明人 SAWABE HIROSHI
分类号 B23K31/02;B23K1/00;B23K1/015;B23K35/26;C22C13/00;H05K3/34;(IPC1-7):B23K31/02 主分类号 B23K31/02
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