| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a laser marking device and method that shows a shallow machining depth and a superior visibility in marking, with a laser beam, an i-chip-exposed IC package such as a CSP and thin type electronic parts. SOLUTION: This is a laser marking device by which a workpiece 14 is irradiated with a laser beam 12 for pattern marking. The device is equipped with a laser generator 11 for outputting a laser beam, a diffraction device 18 by which the power density distribution of the laser beam outputted from the laser generator is converted to that of multiple peaks, and an image forming optical instrument 20 which guides, to the workpiece, the laser beam relating to the power density distribution with multiple peaks for image formation and which forms, as a pattern on the surface of the workpiece, a rugged part corresponding to the power density distribution with multiple peaks.</p> |
