发明名称 SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD, SEMICONDUCTOR DEVICE MANUFACTURING METHOD, AND CONVEYING APPARATUS
摘要 PROBLEM TO BE SOLVED: To provide a substrate processing apparatus in which it is possible to reduce the size of a feed screw axis or a driving unit of a motor by balancing up-down pressure of platform, omit a pressure control valve and a control system of complex structure by communicating to atmosphere, prevent the entry of dust and lubricant gas within a hollow unit into a stand by room by separating the feed screw axis or guide rail from the stand by room by a first bellows and a second bellows, and prevent the bellows from being deformed due to the difference of pressure between inside and outside of the hollow unit by deformation prevention plates. SOLUTION: A first bellows 41 and a second bellows 42 are arranged on an upper portion and a lower portion of the platform of an boat elevator 20 installed in the stand by room of a load lock chamber 4 respectively, thus insides of hollow units of the first and second bellows, 41 and 42, are communicated to atmosphere pressure. A plurality of deformation prevention plates 45 are interposed in a vertical direction at same internals between the first and second bellows 41 and 42, with each deformation prevention plate 45 being guided by the plurality of auxiliary guide rails.
申请公布号 JP2003017543(A) 申请公布日期 2003.01.17
申请号 JP20010196539 申请日期 2001.06.28
申请人 HITACHI KOKUSAI ELECTRIC INC 发明人 MATSUNAGA TATSUHISA;SEKIYAMA HIROSHI
分类号 C23C16/54;H01L21/205;H01L21/677;(IPC1-7):H01L21/68 主分类号 C23C16/54
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