| 摘要 |
PROBLEM TO BE SOLVED: To provide an interposer and a semiconductor package capable of reducing the warpage of the package and a shear stress at a bonded interface even in mounting. SOLUTION: The semiconductor package 100 is provided with a semiconductor chip 1, an interposer substrate 2, slits 6 formed on one part between two tops forming the diagonal of the substrate 2 on a region where the chip 1 is mounted on the substrate 2 so as to be perpendicular to a long side, and sealing resins 3 for sealing fine metal wires 5 for connecting between electrodes 9 formed on the substrate 2 and the chip 1. By this configuration, in mounting the package 100 on the substrate 2, the warpage of the substrate 2 can be reduced by the slits 6. Also, in mounting the package 100 on a mother board by solder bonding, a shear stress generated on an interface at the substrate 2, the chip 1 and the resins 3 due to variations in bonding temperature can be reduced. |
