| 摘要 |
PROBLEM TO BE SOLVED: To provide a cooling equipment of an electronic device which enables improvement of the cooling performance, using a simple structure. SOLUTION: The cooling equipment 1 for cooling the electronic device 3 is disposed, together with an equipment 2B of a heat source, and it stores the electronic device 3, having electronic components and cools the electronic device 3 indirectly using the air which is supplied from outside the equipment and is exhausted to the outside of the equipment. On a part of an external wall of the cooling equipment which is opposite with the heat source, a heat radiating layer 7 is formed which reduces a quantity of heat radiation to be made incident into a part of the external wall 5A and 5B. The heat radiation layer 7 may be a metal film having a low radiation rate, or a tape or a film having low radiation rate. Furthermore, the surface roughness of the heat radiation layer is set small, and a protective layer for protecting the heat radiation layer, both physically and chemically, is formed on the uppermost surface of the heat radiating layer 7.
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