发明名称 MANUFACTURING METHOD FOR SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To easily micronize the channel length of a transistor. SOLUTION: A first impurity polycrystal semiconductor film 11 composed of polysilicon containing impurities and a first insulation film 12 are formed on a semiconductor substrate 10. Then, the first insulation film 12 and the first impurity polycrystal semiconductor film 11 are opened by a prescribed pattern and an opening 13 is provided. Then, from the opening 13, ion implantations 15a and 15b are obliquely performed. By the oblique ion implantations 15a and 15b, a region 16c where ions are not implanted is formed at the center of the semiconductor substrate 10 in the opening 13. Then, a sidewall spacer 17 is formed at the opening 13 and a gate electrode 19 is formed.
申请公布号 JP2003017690(A) 申请公布日期 2003.01.17
申请号 JP20010198778 申请日期 2001.06.29
申请人 SONY CORP 发明人 OKUBO KENICHI
分类号 H01L21/331;H01L21/265;H01L21/336;H01L21/8222;H01L21/8248;H01L21/8249;H01L27/06;H01L29/732;H01L29/78;(IPC1-7):H01L29/78;H01L21/822;H01L21/824 主分类号 H01L21/331
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