发明名称 HEAT SINK
摘要 PROBLEM TO BE SOLVED: To reduce ventilating resistance and heat radiation performance in a heat sink made of an extruded aluminum shape material with fins used for an electronic device or an information device incorporating the electronic device, and to reduce the heat sink, the electronic device and the information device in weight by reducing the thickness of each fin within a prescribed range. SOLUTION: A heat sink 1 made of an extruded aluminum shape material with fins is provided with a plate base 2 and parallel fins 3 disposed on one surface thereof. The plate base 2 has a width of 25-400 mm, a length of 25-40 mm and a thickness of 2-5 mm. Each fin 3 has a height of 1-30 mm and a space between the fins 3 is 1-1.9 mm, and each fin 3 has a thickness of 0.1-0.8 mm.
申请公布号 JP2003017633(A) 申请公布日期 2003.01.17
申请号 JP20010374689 申请日期 2001.12.07
申请人 SHOWA DENKO KK 发明人 TAKE KOICHIRO;IWAI ICHIRO;HAYASHIDA YOSHIHIRO;FUJIOKA MAKOTO
分类号 H01L23/36;H05K7/20;(IPC1-7):H01L23/36 主分类号 H01L23/36
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