发明名称 METHOD FOR FORMING THIN FILM, AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To suppress ruggedness of a thin film generated by an aggregation at formation of the thin film. SOLUTION: A method for forming the thin film comprises steps of applying a power between a pair of electrodes in side a high-vacuum housing to set a gas in the housing to a plasma state to generate ions, making the ions collide against a target, made of a material, used as the thin film, coating atoms which recoiled from the target on a substrate to form the thin film. In this method, the film is formed with the power changed with passage of time.
申请公布号 JP2003017441(A) 申请公布日期 2003.01.17
申请号 JP20010200716 申请日期 2001.07.02
申请人 SEMICONDUCTOR LEADING EDGE TECHNOLOGIES INC 发明人 FUSHIDA ATSUO
分类号 C25D7/12;C23C14/34;H01L21/203;H01L21/285;H01L21/768;(IPC1-7):H01L21/285 主分类号 C25D7/12
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