发明名称 SOLID IMAGING DEVICE
摘要 PROBLEM TO BE SOLVED: To remarkably suppress lowering of inside generation voltage applied on a substrate and optimize an accumulation charge amount of a photodiode. SOLUTION: A metal wiring layer in a protection circuit part 43 is separated into a first metal wiring layer connected to n type dispersion layer areas 36, 37 being a source area and applying first voltage through a gate/source terminal 54, and a second metal wiring layer connected to a p type well area 32 and applying second voltage VL through a p well terminal 55, and the second voltage is set lower than the first voltage.
申请公布号 JP2003017576(A) 申请公布日期 2003.01.17
申请号 JP20010203815 申请日期 2001.07.04
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 KAMISAKA WATARU;KURIYAMA TOSHIHIRO;ASAUMI MASASHI;MATSUDA YUJI;NIIZOE MASATO;TSUKAMOTO AKIRA
分类号 H01L27/148;H01L21/822;H01L27/04;(IPC1-7):H01L21/822 主分类号 H01L27/148
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