| 摘要 |
PROBLEM TO BE SOLVED: To form a layer insulation film, capable of preventing F and H from being diffused from an FSG film and preventing RC delay. SOLUTION: After forming a USG film on the surface of a metal wiring formed on a substrate, a nitride film is formed on the surface of this USG. After this, FSG is formed on the surface of this nitride film, to form the layer insulation film.
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